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Filp Chip packaging product can use 4-16 layer substratewith ABF and PP which can meets single chip and multi chip integrated packaging with different ball diameters of 0.76/0.50/0.30/0.40/0.25. It is suitable for high-end products such as various VPS Core devices, computing and data processing products.
① Provide co-design and co-simulation services in multiple physical domains such as electricity, heat, stress, and fluid so as to empower product value and shorten R&D cycle;
② ABF scheme supports narrower line width/spacing and high-speed products; PP solution gives higher reliability and meets sinicization requirements.
③ Products packaged by HfcBGA has higher air tightness and better heat dissipation ability.
